HKUST's Flip-Chip Technology Transferred for Industrial Use

Abstract

[evdate 1999-10-12] For release 8 October 1999

HKUST'S FLIP-CHIP TECHNOLOGY TRANSFERRED FOR INDUSTRIAL USE

Cutting-edge "flip-chip" integrated circuit (IC) packaging technology developed by the Hong Kong University of Science and Technology (HKUST) has been transferred to Hua Ko Electronic Co Ltd, a major local manufacturer of integrated circuits. This novel technology will be showcased at the Hong Kong Electronics Fair '99 to be held at the Hong Kong Convention and Exhibition Centre from 12 to 15 October 1999.

"Flip-chip technology will become a major force in high-end IC packaging and will replace the wire bonding technology. The new technology enables manufacturers to produce electronic products with a smaller size, faster speed and higher frequencies," said Prof Philip Chan, Head of HKUST's Electrical and Electronic Engineering Department and Director of the Advanced Electronic Packaging & Assembly Cooperative Research Center project which supported the technology transfer to Hua Ko.

In traditional packaging technologies, such as plastic molded packages, the die (or the integrated circuit chip) is usually connected to the external electronic circuits through gold wires. Flip-chip technology can reduce the area of these conventional packages by as much as 90%.

By attaching a minute solder bump with a diameter of between 50 to 250 microns (one micron is one millionth of a meter) to each junction of the die, flip-chip packaging technology eliminates the need for external wiring. Instead, the chip is soldered straight onto the printed circuit board. "The flip-chip technology we have developed is compatible with today's SMT soldering process. This means that manufacturers will not need to radically modify their production line in order to accommodate the new IC packages," explained Prof Chan.

The flip-chip technology transfer project is basically a tripartite collaboration. Hua Ko deals with the commercial aspects; the HKUST team is responsible for developing the technology to attach the solder bump to the die; and the Hong Kong Productivity Council provides the pick-and-place equipment required in the final packaging process.

"We are happy to see that our collaboration with HKUST is so successful. We would like to thank HKUST for helping us acquire this state-of-the-art packaging capability and enhance our competitiveness in the knowledge-based business environment," said Mr Li Hau Kit, Hua Ko's Senior Sales Manager.

Note: Hua Ko Electronic Co Ltd's booth: 2B19-21

Note to Editors: For further enquiries, please contact Mr Wong of the Office of University Development and Public Affairs at 2358-6307 or email pamedia@ust.hk.